Two major current trends in the semiconductor industry - miniaturisation of the devices and shift to new materials - pose the challenges for the contact technology: (i) robustness and stability of operation in ever smaller devices and (ii) compatibility of metal and semiconductor components.
For example, the resistance of present day contacts is strongly affected by fluctuations in the currently being developed sub-22 nm technology. This problem is getting worse for smaller devices. On the other hand, introduction of new materials for high-mobility channels, e.g., Ge and III-Vs, necessitates the search for compatible metals and brings new challenges related to the contact fabrication. Therefore, understanding the dependence of the nanoscale metal-semiconductor interface properties on the atomic structure of this interface, chemical composition disorder, and defects is a key to formulating and exploiting new device concepts. In particular, this understanding is imperative for the developing of optimal contact fabrication procedures for nanoscale semiconductor devices.
The primary aims of this research are:
- Enabling and carrying out multiscale modelling of the optimal chemical compositions and structures of metal-semiconductor interfaces such that the Schottky barrier is minimal
- Analysis of the role of interface defects, strain, and disorder on the carrier transport in CMOS devices
Our methodology allows us to:
- Consider explicitly effects of point defects (<0.5 nm scale), composition disorder (~1 nm scale), and metal granularity (~1-2 nm scale) on the electronic properties of selected metal-semiconductor interfaces
- Incorporate these effects into 3D MC transport simulations through the metal-semiconductor interfaces
- Develop realistic models for source/drain contacts, carry out 2D MC device simulations, and
- Optimise device performance with respect to the properties of the contacts.