Specialist Subjects: Carrier transport in semiconductor devices, ensemble Monte Carlo simulations, quantum transport and drift-diffusion simulations, semiconductor transistors for digital and RF applications, semiconductor lasers
Summary: Aggressive scaling of the conventional metal-oxide-semiconductor field effect transistors is required by the International Technology Roadmap for Semiconductors as conventional devices will hit a limit beyond the 22 nm technology node. Novel, ultra-thin body transistors must be introduced into production in order to sustain the expected increase in device performance. Moreover, both the Silicon device body and the SiO2 dielectric have to be replaced with a higher mobility semiconductor and higher dielectric constant materials.
The proposed fellowship research aims to develop a 'state-of-art' Monte Carlo device simulator which is capable of accurately modelling the low-dimensional properties of ultra-thin body transistors. The simulator will be employed to optimise the ultra-thin body architecture, to benchmark the prospective high mobility materials, and to investigate the impact of high-K dielectrics on channel mobility. It will also focus on the exploitation of different material crystal orientations in the channel.
Summary: Contacts, made up of metal-semiconductor interfaces, are integral parts any semiconductor device. Compatibility of the metal and semiconductor components, homogeneity of structural and electrical characteristics of their interfaces, and robustness and durability of the contacts are crucial for the device proper functionality. Optimal operation of the contacts is a key to realisation of novel devices and development of new device concepts, including high mobility semiconductors based CMOS, tunnelling and spin-based transistors, tunnelling diodes, gas and infrared carbon-nanotube detectors, etc. Two major current trends in the semiconductor industry - miniaturisation of the devices and shift to new materials - pose the challenges for the contact technology: (i) robustness and stability of operation in ever smaller devices and (ii) compatibility of metal and semiconductor components. For example, the resistance of present day contacts is strongly affected by fluctuations in the currently being developed sub-22 nm technology.
Primary aims of the proposed research are
i) enabling and carrying out multiscale modelling of the optimal chemical compositions and structures of metal-semiconductor interfaces such that the Schottky barrier is minimal;
ii) analysis of the role of interface defects, strain, and disorder on the carrier transport in CMOS devices.
Summary: - to implement a MOSFET geometry within the parallel 3D finite element Monte Carlo simulator,
- to incorporate a density gradient method within the developed 3D Monte Carlo simulator to introduce quantum-mechanical corrections due to carrier confinement in the channel,
- to employ the parallel 3D Monte Carlo simulator to study the performance of multigate transistors like nanowires and FinFETs with realistic geometries,
- to incorporate physical models to evaluate the impact of atomicity in the multigate transistors like trapped and fixed charges in the high-K dielectric gate stacks, and interface roughness and interface phonons between the semiconductor and the high-K dielectric layers,
- to investigate impact of atomicity induced variations on the performance of multigate transistors.
A finite element 2D heterostructure Monte Carlo simulator has been developed for modelling of metal-oxide-semiconductor field-effect transistors (MOSFETs) which incorporates: (i) realistic doping profiles; (ii) Fermi-Dirac statistics using self-consistent calculations of the Fermi energy and electron temperature; (iii) interface roughness and interface optical phonons scatterings; and (iv) quantum confinement effect using the effective quantum potential approach. This simulator is used to: (i) forecast the performance of III-V and metal-oxide-semiconductor field effect transistors (MOSFETs) in comparison with equivalent Si based MOSFETs, and (ii) study the performance and optimise the design of thin-body MOSFETs.
In addition, a finite element parallel 3D Monte Carlo simulator has been developed in collaboration with University of Santiago de Compostela for modelling of multi-gate MOSFETs and nanowires which incorporates: (i) realistic doping profiles generated analytically; (ii) interface roughness scatterings; and (iii) quantum confinement effect using the density gradient approach.
A ensemble heterostructure Monte Carlo simulator using finite element mesh has developed for modelling of high electron mobility transistors (HEMTs). This simulator which includes impact ionization; Schottky gate tunnelling using a particle based model and quantum corrections.
The electric properties of GaN-based HEMTs like the wide bandgap, high electron mobility, and high output power density provide an excellent opportunity to employ these devices in many power applications and applications for harsh environments. However, the current collapse and degradation of the device pose a significant hindrance to wider commercial use of GaN-based HEMTs. The device degradation is linked with a lattice defect formation caused by excessive stress driven by the electric field via the inverse piezoelectric effect. Thus, the collapse and the degradation are associated with charge trapping in the device. Commercial drift-diffusion simulations are used to investigate these effect on I-V characteristics of GaN-based HEMTs and optimise their design to minimise the current collapse and the device degradation.
A self-consistent calculation approach has been developed to obtain electron intersubband relaxation and capture times, electron densities and temperatures as a function of applied electric field in cascade intersubband semiconductor lasers. Moreover, the electron capture time via electron-polar optical phonon and electron-electron interactions have been calculated and compared with measurements from pump-probe experiments in order to get insight into physical processes in separate confinement heterostructure quantum well lasers.
You will continue in the development of a 3D finite element Monte Carlo device simulator in order to investigate and optimise future multigate semiconductor transistors with the complex 3D geometries for the sub-22 nm technology. This 3D simulator can run in parallel utilising the message passing interface (MPI) standard library. You will continue in the incorporating quantum-mechanical corrections to account for a carrier confinement in the channel using a density gradient method. Then, you will create unstructured meshes that will have mesh points at real atom positions in the crystal lattice of Si body and at the semiconductor-dielectric interface. Later, you extend the simulator by adapting high mobility materials like GaAs and InGaAs which are currently intensively researched for these novel device architectures.
This project will be supervised jointly by Dr Karol Kalna (EPSRC Advanced Research Fellow) and by Professor Oubay Hassan in Civil and Computational Engineering Centre, School of Engineering, Swansea University. In the last Research Assessment Exercise, the Times Higher rated Civil Engineering second in the UK.
Informal enquires can be addressed to k.kalna(at)swansea.ac.uk
2. Modelling of Metal-Semiconductor Contacts for the Next Generation of Nanoscale TransistorsContacts, made up of metal-semiconductor interfaces, are integral part any semiconductor device and their quality is crucial for the device proper functionality. Two major current trends in the semiconductor industry - miniaturisation of the devices and shift to new materials - pose the challenges for the contact technology: (i) robustness and stability of operation in ever smaller devices and (ii) compatibility of the metal and semiconductor components. The introduction of new, high-mobility channel materials, like Ge and III-Vs, requires the search for compatible metals and brings new challenges to the contact fabrication.
The aims of this PhD research will be i) to enable and to carry out multiscale modelling of the optimal metal-semiconductor interfaces, such that the Schottky barrier is minimal and ii) to analyse the role of interface defects, strain, and disorder on the carrier transport in nanoscale multi-gate transistors. The research will be closely coordinated within the EPSRC grant "Multiscale Modelling of Metal-Semiconductor Contacts for the Next Generation of Nanoscale Transistors" in collaboration with Dr. Peter Sushko, University College London (UCL) and supported by IBM, TSMC, IMEC, and University of Glasgow. The PhD candidate will closely work with one post-doctoral researcher at Swansea and one post-doctoral researcher at UCL. He will help to bridge ab-initio modelling (DFT) across the metal-semiconductor interfaces using 3D transport Monte Carlo and Non-Equilibrium Green's Functions device simulations based on finite element mesh with atomistic resolution. The research in at forefront of the advanced modelling of access regions for a future 3D FinFET 22nm CMOS technology.
This PhD project will be supervised jointly by Dr Karol Kalna (Senior Lecturer and EPSRC Advanced Research Fellow) and by Dr Antonio Martinez (Senior Lecturer and EPSRC Acceleration Carrier Fellow), at School of Engineering, Swansea University. Ideally, you should have a background in physics, engineering, or computer science, with an interest in either atomistic scale semiconductor devices, or atomic scale material modelling, or high-performance computing, or computational modelling.
Informal enquires can be addressed to k.kalna(at)swansea.ac.uk.

Ph.D., RNDr.
College of Engineering
Swansea
TEL: +44 (0) 1792 606678
FAX: +44 (0) 1792 295676
E-MAIL: k.kalna@swansea.ac.uk