Mask Aligner for photolithography:

mask-aligner   Suss MA8 Gen3, the dedicated solution for industrial research and operator assisted alignment, is the new benchmark in full-field lithography for MEMS, Advanced Packaging, 3D Integration and Compound Semiconductor markets. In addition, it supports emerging processes like micro- and nano-imprinting, bond alignment and UV-bonding as well as selective Plasma activation with its unmatched variety of options and maximum flexibility.


  • MEMS
  • Sensors
  • Microfluidics
  • Semiconductors
  • Photovoltaics
  • Optoelectronics / photonics
  • Scaffold Fabrication



  • UV broad-band, I-line (365 nm) and G-Line (436 nm) wavelength are available.
  • Exposure methods: flood, soft and hard contacts, low-vacuum and vacuum contacts.
  • Mask size: 4"×4", 5"×5", 7"×7" and 9"×9" .
  • Sub micron resolution
  • Wafer size: small pieces, 2", 3", 4", 6" and 8“.
  • Functional Top-Side Alignment (TAS) and Bottom-Side Alignment (BSA).