CVD tool (200mm wafer capability):

sptscvd

SPTS' Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging. The PECVD tool is capable of depositing a wide range of materials and is is extensively used for fabrication of semiconductor, MEMS and PV devices.

Capabilities:
Wafer sizes – small pieces to 200mm wafers.
Plasma enhanced deposition of:
Amrphous silicon
Silicon dioxide
Silicon Nitride
Developing capability for:
Atomic Layer Deposition (ALD)
Nanostructure growth (eg CNT)
Liquid delivery system
Can deposit – a-Si, TEOS, ZnO, SiC, SiO2, Si3N4, DLC

Applications

  • MEMS (Micro-Electro Mechanical Systems )
  • Microfluidics
  • Semiconductors
  • Waveguides
  • Solar PV
  • Advanced Packaging
 

Case Study

Development of “enhanced light-capture” antireflective coatings.

Silicon nitride, deposited using the SPTS plasma tool, is often used as an ARC in solar PV cells.  By combining silicon nitride layers with different refractive indices and other thin films like silicon dioxide, we can produced ARCs with enhanced light capture – the amount of light entering the PV cell. This consequently increases the efficiency of the PV cell.